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  • Documentation and Packaging Inspection

    Verifies labeling, date codes, part numbers, and packaging integrity to ensure authenticity and compliance.

  • External Visual Inspection

    Identifies surface defects, marking anomalies, lead damage, and other physical irregularities under standard magnification.

  • Digital Microscopy

    High-powered magnification (up to 500x) detects blacktopping, sanding, oxidation, and retinning.

  • Digital Imagery

    HD imaging (60x) provides distortion-free inspection of component surfaces.

  • Dimensional Measurement

    2D/3D measurement system with high depth of field captures precise component details.

  • Reel Counting

    AI-powered X-ray counting machine ensures accurate part quantity without unpacking.

  • Energy Dispersive X-ray Spectrometry (EDX)

    Analyzes elemental composition to detect material inconsistencies, coatings, and potential counterfeit components.

Contact Us

FUTURETECH COMPONENTS PTE LTD (Singapore)
Address:3 Coleman Street #04-35 Peninsula Shopping Complex, Singapore 179804
+65-94871798

FUTURETECH COMPONENTS LTD (Vietnam)
Address:11th Floor,Viet A Building,No.9 Duy Tan Street,Cau Giay District,Hanoi,Vietnam
+84-345873200

FUTURETECH COMPONENTS LTD (Hong Kong)
Address:Unit D12 On 16th Floor, Jing Ho Industrial Building, Nos.78-84 Wang Lung Street, Tsuen Wan, New Territories, Hongkong China
+852-69495643

FUTURETECH COMPONENTS LTD (Shenzhen)
Address: 9A HIVAC Technology Building, No.2 South 8th Road of Science and Technology, Yuehai Street, Nanshan District, Shenzhen, China
+86-0755-82814007


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