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Decapsulation
Exposes die structure, verifies chip size, manufacturer logos, and part numbers.
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Heated Solvent Testing
Identifies counterfeiting signs like sand marks, texture inconsistencies, and blacktopping.
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Solderability & BGA Reflow Testing
Confirms lead coating durability and assesses oxidation/corrosion levels.
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Parallel Lap
Gradually removes material layers through precision grinding and polishing to expose internal structures for defect analysis.
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Hot Spot Test
Uses infrared imaging to detect localized overheating, identifying potential failure points in electronic components.
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Bond Pull & Die Shear Testing
Measures bond strength and material integrity for compliance with reliability standards.
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Cross-Section Analysis
Examines internal component structure to identify defects that could lead to failures.
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Thermal Cycle
Repeatedly exposes components to alternating high and low temperatures to assess reliability under thermal expansion and contraction.
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Thermal Shock
Subjects components to sudden and extreme temperature changes to evaluate resistance to rapid thermal transitions.
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Burn-in
Operates components under elevated temperature and electrical stress for an extended period to detect early-life failures.
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Drop Test
Simulates mechanical shock by dropping components from a specified height to assess durability and structural integrity.
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Vibration Test
Applies controlled vibrations to components to evaluate resistance to mechanical fatigue and transportation stress.
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Environmental Exposure (Temperature And Humidity)
Tests component performance under extreme temperature and humidity conditions to ensure long-term reliability.
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Salt Spray Test
Exposes components to a salt mist environment to assess corrosion resistance, particularly for metal parts and coatings.
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Electrical Overstress Testing
Applies excessive electrical stress to determine a component’s failure thresholds and safety margins.
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Mechanical Stress Testing
Evaluates component resilience by applying physical forces such as bending, compression, or torsion to simulate real-world stresses.
