SEMICON Taiwan 2025 will debut in September. With the sharp increase in demand for AI chips and HPC, the global semiconductor industry is ushering in a new generation of advanced packaging. This year, SEMICON Taiwan will focus on advanced packaging technologies including 3DIC, panel level fanout packaging (FOPLP), chiplets, and common packaging optometry (CPO). What is even more noteworthy is that the long prepared SEMI 3DIC Advanced Packaging Manufacturing Alliance (SEMI 3DICAMA) will also be officially launched at this exhibition.
SEMICON Taiwan 2025, the highlight of this year's semiconductor industry, will hold multiple international forums on forward-looking technologies on September 8th and will be held from September 10th to 12th. Because Taiwan, China's semiconductor supply chain has a complete competitive advantage in the global upstream and downstream, Taiwan, China has previously formed two supply chain alliances, CoWoS and Silicon Photon. The SEMI 3DIC Advanced Packaging and Manufacturing Alliance (SEMI 3DICAMA), which is highly concerned by the outside world, will also be officially launched at this exhibition.
SEMI said that Asian countries/regions are actively promoting the upgrading of advanced packaging technology, and Taiwan, China, China, has become one of the core bases for the development of advanced packaging in the world with its complete semiconductor ecosystem and technological innovation strength. In order to integrate global industrial resources, promote innovation cooperation, and overcome technological bottlenecks, SEMI actively promotes the "SEMI 3DIC Advanced Packaging Manufacturing Alliance", which will hold its launch conference on September 9th. The alliance will focus on four major tasks: connecting industrial cooperation, strengthening supply chain resilience, assisting in the introduction of existing standards, accelerating technological upgrading and commercialization, and working with ecosystem partners to create a highly integrated and efficient packaging ecosystem.
SEMICON Taiwan 2025 will connect the Heterogeneous Integration International Summit Forum (HIGS), FOPLP Innovation Forum, and 3DIC Global Summit Forum, focusing on comprehensive issues from design, materials, processes to supply chains. The Heterogeneous Integration Summit Forum will invite leading companies such as Sunlight, Broadcom, Lightmatter, MediaTek, NVIDIA, Sony, and TSMC to explore the technological achievements and practical challenges of 3DIC, CPO, and AI packaging supply chains. The FOPLP Innovation Forum invites international heavyweight enterprise technology experts including AMD and Licheng to share the latest technological progress and market application strategies.
