Electronica China 2025, held from April 15 to 17 at the Shanghai New International Expo Center, brought together nearly 1,700 leading exhibitors and over 100,000 professional visitors from around the world. The event served as a vital platform for exploring cutting-edge technologies and applications in sectors such as new energy vehicles, intelligent manufacturing, the Internet of Things (IoT), and green energy.
At a pivotal moment for the global electronics and information industry, the World Semiconductor Trade Statistics (WSTS) projects that the global semiconductor market will grow by 11.2% in 2025, reaching approximately USD 697 billion—injecting fresh momentum into the value chain. On-site, a wide array of innovations were showcased, including automotive-grade high-reliability chips, advanced packaging technologies, edge AI, low-power IoT solutions, SiC power modules, and intelligent connectors—demonstrating the pulse of an industry empowered by AI and ubiquitous connectivity.
Global Semiconductor Market & Exhibition Landscape
The global semiconductor market is expected to reach USD 697 billion in 2025, driven primarily by the logic and memory segments, with logic chips growing over 17% year-on-year and memory over 13%. The Americas and Asia-Pacific regions are projected to maintain double-digit growth, reflecting robust momentum across the sector.
Since 2005, Electronica China has served as a premier platform for technological innovation and industry collaboration. The 2025 edition featured nine themed exhibition zones covering the entire supply chain—from design and development to application—spanning data centers, smart wearables, industrial IoT, wireless communication, and more. This year’s exhibition welcomed 1,700 exhibitors, offering extensive opportunities for collaboration and knowledge exchange.
Automotive Electronics: Smart Driving Meets High Reliability
The rapid evolution of new energy and connected vehicles is setting high demands for high-voltage SiC/GaN power modules, automotive-grade SoCs, domain controllers, and multi-sensor fusion systems.
● STMicroelectronics unveiled its GNSS high-precision six-constellation four-band positioning chip, supporting GPS, Galileo, BeiDou, and others. It delivers centimeter-level accuracy and meets ASIL-B safety standards, ideal for autonomous driving applications.
● Analog Devices (ADI) showcased its GMSL-based robotic vision transmission solution, supporting 3/6/12 Gbps data rates with low latency, low error rates, and single-cable power delivery—also compliant with ASIL-B standards.
● Naxin Micro introduced its NS800RT series real-time MCUs, powered by an Arm Cortex-M7 core at 260 MHz, featuring large tightly-coupled memory and high-speed caches, offering computing performance comparable to high-end dual-core MCUs for automotive and energy control applications.
Industrial & Robotics: Perception and Decision-Making in Harmony
● Texas Instruments (TI) featured the 48 V/16 A GaN three-phase inverter reference design (TIDA-010936) and a 4 kW integrated GaN inverter (TIDA-010956), tailored for motor-integrated servo drives and robotics. These designs feature built-in GaN FETs, drivers, and bootstrap diodes, with high power density and accurate current sensing.
● Geehy Semiconductor introduced the G32R501 MCU based on the ARM Cortex-M52 dual-core architecture, integrating proprietary math instruction extensions, 3.45 Msps high-speed ADC, and wide temperature certification—ideal for industrial automation and multi-axis motion control.
● GigaDevice demonstrated the DexH13 dexterous tactile robotic hand, featuring 1,140 ITPU tactile units and an 8MP eye-in-hand camera, enabling micron-level operation and human-like feedback across automotive, healthcare, and logistics sectors.
AI & IoT: Smart Edge and Ubiquitous Connectivity
In consumer electronics,
● TDK launched an enhanced full-color laser AR/VR module based on Direct Retinal Projection (DRP) technology, significantly improving color gamut and visual comfort, enabling lighter and longer-lasting AR/VR devices.
● SmartSens introduced its SFCPixel® AI glasses and binocular depth camera solutions, utilizing advanced pixel structures and AI algorithms for night vision imaging and real-time environmental perception without motion artifacts.
● Winbond unveiled CUBE edge AI storage, with 2.5D/3D packaging and SoC integration, providing IO bandwidth up to 1,024 channels for HBM-level performance at the edge.
● Dongxin Semiconductor presented large-capacity, low-power NOR Flash with WLCSP packaging, meeting biocompatibility and ultra-thin requirements for wearables.
Clean Energy & Green Solutions
In the new energy and energy storage sectors:
● TI showcased a GaN-based 10 kW single-phase string PV inverter and battery management reference designs for high-voltage lithium and LiFePO4 batteries, boosting integration and safety of residential energy storage systems.
● Tianrun Semiconductor brought SiC 6” wafers, MOSFETs, and SiC half-bridge-based synchronous Buck converters, offering high voltage tolerance and power density.
● MORNSUN introduced the KJB/KUB series buck/boost power modules with ultra-wide input, low no-load power consumption, and high efficiency, suitable for industrial and robotics systems.
Connector & Power Technologies: Ensuring Reliable Connectivity
● TE Connectivity showcased 10G-class high-speed connectors and the CSJ series high-voltage connectors, supporting high-frequency, high-voltage transmission for autonomous and electrified vehicles.
● Amphenol introduced Ve-NET™ automotive Ethernet connectors, supporting 1000BASE-T1 to 10GBASE-T1 standards, compliant with USCAR-2 and LV214, and available in sealed/unsealed configurations.
● Littelfuse presented AXGD series ESD protection devices, featuring low capacitance, low leakage, and high voltage ratings, ideal for in-vehicle entertainment and RF systems.
Forums and Industry Dialogues
Several high-profile forums were held alongside the exhibition:
● The AI Technology Innovation Forum 2025 (April 15) gathered experts from Alibaba DAMO Academy, GigaDevice, Infineon, and others to explore AI chip applications in servers and terminals.
● The New Energy and Intelligent Vehicle Technology Forum (April 16) focused on domestic alternatives for automotive-grade chips and smart driving system integration.
● Additional summits on motor drive technologies, high-performance robotics, and third-generation semiconductors offered in-depth insights into evolving industry trends.
Conclusion
