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Electronics Weekly News | September 1–7, 2025


Electronics Weekly News | September 1–7, 2025


This week, the semiconductor industry witnessed notable developments across government policy, corporate integration, manufacturing investments, market pricing, and next-generation connectivity. Below is a roundup of the key updates.



U.S. Hosts Tech Leaders, Reiterates Semiconductor Tariff Plans

At a rare gathering in Washington, the U.S. administration met with more than 20 top executives including leaders from Microsoft, Apple, Google, Meta, and OpenAI. During the discussion, officials reiterated plans to impose tariffs on semiconductor imports from companies without U.S. manufacturing investments. Firms with domestic production commitments, such as TSMC, Samsung, and SK hynix, are expected to receive exemptions. Apple’s announced $600 billion U.S. manufacturing investment was highlighted as an example of alignment with national policy goals.


SK hynix Completes Integration of Intel’s Dalian NAND Facility

SK hynix finalized the corporate transition of Intel’s NAND and SSD business in Dalian, officially renaming the entity as SK hynix Semiconductor Storage Technology (Dalian) Co., Ltd. This marks a critical step in the company’s $9 billion acquisition of Intel’s NAND operations. With this integration, SK hynix strengthens its position as the world’s second-largest memory supplier, reinforcing competitiveness in enterprise SSDs and NAND flash solutions while enhancing its manufacturing footprint in China.


India to Begin Commercial Semiconductor Production by 2025

At Semicon India 2025, Prime Minister Narendra Modi announced that India will start commercial semiconductor production by the end of 2025. Supported by the $8.7 billion Semicon India initiative, the country has already approved $18.3 billion worth of projects across six states, including Tata’s 28nm wafer fab and Foxconn-HCL’s packaging plant. India is also advancing international partnerships with companies such as Renesas, Micron, and Infineon, positioning itself as an emerging force in the global semiconductor supply chain with ambitions to capture 10% of the global market by 2030.


Semiconductor Equipment Billings Rise 24% YoY in Q2

According to SEMI, global semiconductor equipment billings reached $33.07 billion in Q2 2025, up 24% year-over-year and 3% quarter-over-quarter. Growth was fueled by leading-edge logic, HBM-related DRAM, and strong shipments to Asia. SEMI noted that the industry posted more than $65 billion in H1 revenue, building on the record $117 billion in 2024, as chipmakers continue to expand capacity for AI-driven demand and regional supply chain resilience.

1. Q2 semi equipment billings up 24% YoY  


Schaeffler and Rohm Launch 800V SiC Traction Inverter Module

Schaeffler has begun mass production of an 800V automotive traction inverter module for a Chinese OEM, leveraging silicon carbide (SiC) MOSFETs supplied by Rohm. The module supports RMS currents up to 650A, significantly enhancing EV powertrain efficiency and enabling innovative system-level functions such as interleaved boost conversion. The rapid one-year development cycle underscores the accelerating role of SiC technology in electric mobility.


TSMC Announces New Price Hikes on Advanced Nodes

TSMC plans another 5–10% price increase on 5nm, 4nm, 3nm, and 2nm processes in 2026, following an earlier adjustment in January. Rising costs from U.S. tariffs, exchange rate volatility, and upstream supply chain pressures are driving the decision. While helping TSMC balance profitability, these changes may reshape downstream strategies as chip designers reassess cost structures and competitors accelerate technology roadmaps.


Qorvo Showcases Dual Strategy in Wireless Connectivity

At the 2025 IOTE Expo, Qorvo unveiled its latest UWB (Ultra-Wideband) SoCs and multi-protocol connectivity chips supporting Matter, Zigbee, and BLE. The new QM35825 and QPF5100Q series offer ±6 cm ranging precision and integrated MCU+RF architectures, enabling applications from industrial automation and healthcare to automotive digital keys and child presence detection. UWB is also making inroads into Wi-Fi routers, where combined Wi-Fi+UWB devices are beginning to redefine enterprise and smart home connectivity.

Qorvo

Outlook

The semiconductor industry remains dynamic, shaped by geopolitical trade measures, corporate consolidation, capacity investments, and rapid adoption of emerging technologies such as SiC in EVs and UWB in IoT. Pricing adjustments at the foundry level and government-led incentives will continue to influence global supply chain strategies.

At Futuretech Components, we remain committed to supporting our partners with high-quality, traceable electronic components sourced from trusted channels. As a global distributor, we help customers navigate market volatility, manage cost pressures, and secure resilient supply chains in an evolving semiconductor landscape.

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